PCB
High Speed PCB for Communication Backplane
M6 material, 3.0mm thickness, 3.5/4mil line width, 0.25mm min hole, ENIG finish, back drilling + impedance control
Product Details
| Application | Communication High Speed Backplane |
|---|---|
| Layers | 24 Layers |
| Board Thickness | 3.0mm |
| Material | M6 |
| Line Width/Space | 3.5/4mil |
| Minimum Hole Size | 0.25mm |
| Surface Finish | ENIG |
| Special Technology | 12 Groups Back Drilling + 32 Groups Impedance + Depth Milling + Irregular Copper |
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