Our PCBA factory has enhanced the SMT production line with 3D SPI and AOI inspection systems. The 3D SPI system provides 100% solder paste inspection accuracy, while the post-reflow 3D AOI system improves defect detection for high-volume assembly.
The upgraded line also includes X-ray inspection for BGA and QFN packages, ensuring hidden solder joint quality. These inspection capabilities are integrated into our 9-step quality control process from IQC through OQC.
The enhanced SMT line supports our commitment to quality as our cornerstone of survival, providing customers with reliable PCBA assembly across diverse industries including medical, automobile, industrial control, and communication sectors.