Our PCB factory has completed a major equipment upgrade, adding new drilling and exposure systems to support high-precision multilayer board production. The upgraded capabilities include minimum line width down to 3 mil and minimum mechanical hole size of 0.15mm.
The new equipment supports up to 60-layer prototype and 32-layer standard production boards, with maximum panel size of 1200 x 540mm. Surface finish options include ENIG, HASL, OSP, Immersion Tin, Immersion Silver, and ENEPIG.
With this upgrade, XHT is better positioned to serve customers requiring complex board designs for 5G communication, automotive electronics, and high-speed digital applications.